Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 76 items
Anodic bonding device
Batch processing achieves low dew point. High-precision alignment can be performed in the atmosphere or in a vacuum. Changing the conditions of the joining atmosphere is easy. Since only the necessary parts are heated, distortion is minimal during joining. There is no variation between rods, resulting in good yield. Automation of operations allows for labor savings.
Surfactant activation bonding device
It can apply a maximum pressure of 1500 kg to an 8-inch wafer and heat it up to a maximum of 1100°C. It is also compatible with ultra-high vacuum.
Surface active bonding device (room temperature bonding). Bonding at low temperatures without using sealing materials!
●This is an optimal system for the development of next-generation MEMS devices and semiconductor packaging. ●It performs high-precision alignment and weight application in ultra-high vacuum. ●It allows for the bonding of dissimilar materials by directly bonding without heating the substrate. ●It is compatible with load lock systems and cluster systems.
![[Comprehensive Catalog] Surface Activation Bonding Device SAB Series](https://image.mono.ipros.com/public/product/image/26f/2000113743/IPROS3080349482417492217.JPG?w=280&h=280)
It can flexibly accommodate changes in sample shape, allowing for various types of bonding experiments, from those that do not use sealing materials to those that can be bonded at room temperature.
We have achieved wafer bonding that provides bulk fracture strength at room temperature. We cater to a range of bonding equipment from research and development to mass production. Our technology is used in a wide variety of fields, including wafer-level packaging and 3D integration. For development purposes, we offer a series of research-grade surface activation bonding devices, ranging from those with focused functions for activation treatment and bonding to those equipped with high-precision alignment and analysis capabilities. For mass production, we provide equipment designed for bonding substrates such as silicon and compound semiconductors after activating the bonding surfaces under ultra-high vacuum conditions. This process allows for bonding at room temperature without the use of sealing materials. For more details, please download the catalog or contact us.
For those interested in joining machines and thermography. You can experience proposals for your concerns and a vision of implementation.
The Solution Center consists of a showroom, seminar room, and webinar room, featuring the joining equipment business and sensing solution business. ◆Showroom In the showroom, you can view solution examples that we propose to customers through displays and videos of products and applications from the joining equipment and sensing solution businesses. It is a space where customers can actually "see," "touch," and "experience," allowing them to more concretely feel our efforts to address their challenges and have a more realistic image of implementation. ◆Seminar Room & Webinar Room ■ Seminars on the basics of joining and infrared technology ■ Introduction of new products and applications ■ Individual consultations with sales and technical staff are also available ◆Access Both the showroom and seminar room are located within our Yokohama office. Address: 2-28-2 Hongō, Seya-ku, Yokohama-shi, Kanagawa 246-0015, Japan Avionics Corporation.
Effective for quality assurance and quality control! Stable metal joining is possible with a highly reliable ultrasonic system.
The "PB500" is an ultrasonic precision metal welder that enables stable metal joining and is particularly suitable for small and compact joints. With a unique load control method using a high-resolution digital scale [PAT-P], it quickly follows the workpiece displacement during ultrasonic joining, efficiently transmitting ultrasonic energy to the workpiece with a constant load. Additionally, the high-rigidity press unit, specifically designed for ultrasonic metal joining, ensures sufficient strength and stabilizes processing quality. [Features] ■ The high-rigidity press unit offers high-speed and high-precision control in the range of 10N to 520N. ■ Equipped with a highly reliable digital ultrasonic generator that achieves stable joining quality. ■ Various ultrasonic oscillation modes are available. ■ The device can be automated to meet user needs. ■ The ultrasonic horn is designed to match the shape and material of the workpiece. *For more details, please refer to the PDF document or feel free to contact us.
For various sensors and micromachines! A compact and economical type suitable for research and development.
The "Anodic Bonding Device" allows for easy bonding of heated silicon substrates and glass substrates by applying high voltage. It is a compact and economical type suitable for research and development, with a small tabletop design for the alignment section. The standard sample size is 4 inches, with an option for a maximum of 6 inches. It can be used for various sensors, micromachines, biomaterials, and various optical applications. 【Features】 ■ Easily bonds heated silicon substrates and glass substrates by applying high voltage ■ Compact and economical type suitable for research and development ■ Small tabletop design for the alignment section ■ Standard sample size is 4 inches, with an option for a maximum of 6 inches *For more details, please refer to the related links or feel free to contact us.
Achieving the joining of metals without melting through the use of ultrasound.
Features of Ultrasonic Metal Welders ● Capable of joining not only the same materials but also different materials. ● Allows for low-temperature joining due to solid-state bonding, resulting in minimal thermal impact on the workpiece. ● Significantly reduces power consumption compared to other joining methods. ● Provides a clean working environment. ● Good electrical conductivity at the joint. ● Fewer consumables involved in the joining process. Product List ● High-power ultrasonic metal joining machine ● Compact ultrasonic metal joining machine ● Compact precision ultrasonic metal joining machine ● Ultrasonic wire bonding machine
![Ultrasonic Metal Joining [*Technical Data Gift*]](https://image.mono.ipros.com/public/product/image/3f1/2000686435/IPROS42479912866989863196.png?w=280&h=280)
A basic explanation of what ultrasound is! Download technical materials that include the principles of ultrasonic vibrations.
This document introduces ultrasonic metal joining. "Ultrasonic metal joining" is a technology that joins overlapping metals using ultrasonic vibrations, allowing for the joining of the same material as well as dissimilar materials such as copper and aluminum. We explain "types of metal joining," "ultrasonic metal joining and ultrasonic metal joining machines," and "joinable materials," among other topics. Please take a moment to read it! 【Contents (partial)】 ■ Types of metal joining ■ What is ultrasound? ■ Principle of ultrasonic vibrations ■ Ultrasonic metal joining and ultrasonic metal joining machines ■ Joinable materials *For more details, please refer to the PDF document or feel free to contact us.
A high-power ultrasonic metal joining machine with a maximum output of 12,000W that enables the connection of thick wire harnesses.
**Features** ■ Maximum output of 12,000W ■ Maximum pressing force of 7,000N Joint management using actual load via load cells. By directly detecting the load value and reflecting it in the joining conditions, it becomes possible to set clear joining conditions, achieving stable quality control. ■ Rack-type oscillator compliant with EIA standards Utilizes vertical space effectively without directly stacking equipment on top of each other. By consolidating related devices, such as control of movable parts of fixtures, maintenance and servicing become easier. ■ High positional reproducibility for efficient setup changes The structure establishes positional reproducibility of the vibration system unit, ensuring safe and reliable setup. Additionally, when fixtures are installed, the workspace for exchanging tool horns tends to become limited. The vibration system unit adopts a rail mechanism that allows for attachment and detachment from either the front or back of the device, facilitating work outside the machine and ensuring efficiency. ■ T-slot structure for fixture mounting base The device features T-slot machining in the front and rear directions, making fixture alignment easier. Furthermore, it is less affected by restrictions from screw positions on the base side, increasing the design flexibility of fixtures.
![First, give it a try!! Ultrasonic metal joining test [Now accepting applications]](https://image.mono.ipros.com/public/product/image/2001549304/IPROS3327695508506233145.jpg?w=280&h=280)
We support the first step of ultrasonic metal joining with a rich lineup and the visualization of processes and results.
We provide a testing environment that meets the diverse needs of our customers. We will guide you to the optimal model based on the material and shape of the workpieces you wish to join. Additionally, we offer a wide variety of horns and anvils, allowing for evaluations that closely resemble actual joining conditions. Furthermore, by utilizing our "Joining Management Software J-Tool," test data can be displayed clearly in tables and graphs. This allows for visualization not only of the joining results but also of various condition changes such as pressure, power, and penetration distance. This enables objective evaluations based on numerical data, facilitating the smooth identification of optimal joining conditions. Whether you want to "test if this material can be joined" or "search for the optimal conditions," please feel free to contact us, whether you are a first-time user or someone who is already considering specific options! Our specialized staff will provide solid support for your manufacturing through verification using actual workpieces.
The astonishing repeatability of processing accuracy achieves quality improvement. We provide an easy-to-understand joining logic (waveform data and parameter settings). Comparisons and evaluations are welcome.
The ultrasonic metal bonding machine 'USDB' is an ultrasonic metal bonding machine that achieves high-speed cycle operation, high-speed data transfer, and high-precision position control. The servo motor press pressure control with a one-axis rigid structure realizes ultra-fine position accuracy and high-speed load tracking, providing stable ultrasonic energy addition and dramatically improving processing reproducibility. The new Ethernet/IP connection simplifies the operation management of automated lines and converts all bonding results into big data. 【Features】 - Processing assembly accuracy, operational precision, and ultrasonic control that ensure the ultrasonic vibration energy during bonding is reliably transmitted to the workpiece. - High reliability in position accuracy (1µm) achieved through the rigidity of the distinctive one-piece frame structure. - Original program that realizes high-speed load tracking (stable load) against load fluctuations during bonding. - Easy setting operations enabled by the simple screen MMI (man-machine interface) with a color touch panel. - Unique ultrasonic control method for applications sensitive to frequency and impedance fluctuations. - Protective circuit program included to prevent failures of the ultrasonic oscillator and servo due to overloads. - Excellent bonding reproducibility that allows for easy reading of processing behavior from bonding data waveforms and performing multiple regression analysis of the data.
It is a light scanning type glass microchip automatic bonding system.
This device is an optical scanning glass microchip automatic bonding system. It achieves a significant reduction in bonding time, which was difficult with conventional methods, by selectively scanning and bonding only the areas that require bonding, such as flow paths, using a programmed pattern bonding software. Furthermore, it is also capable of bonding electrode-embedded microfluidic chips, allowing for easy production of functional microchips at your fingertips.
